Internship in Semiconductor Packaging 80 – 100% (f/m/d)
The R&D team Semiconductor Packaging and Reliability Engineering at our Swiss Power Grids Research Center is looking for an intern student with expertise in electrical engineering, physics, materials and analytical methods to contribute to the development of novel semiconductor power modules for e-mobility and grid applications. The intern will interact with a dynamic and multidisciplinary team that will supervise and guide the project. If you have a strong technical background, motivation to develop innovative solutions, and you are goal-oriented, this is your opportunity to contribute in building a stronger and more sustainable energy future. The duration of the internship is six months.
Your Responsibilities
Support technology development and research activities in the development of semiconductor power modules, i.e. process development and prototype manufacturing in a state-of-the-art cleanroom
Perform accelerated lifetime testing, characterize modules before and after aging, supervise the test setup
Perform first steps of the root cause analysis (X-ray, SAM, cross section etc.) and concisely document the test results
Perform electromagnetic and thermal infinite element simulations to validate design features
Create CAD designs of power modules in close collaboration with the team, find creative and efficient solutions to meet demanding and sometimes conflicting requirements
Your Background
Currently pursuing a M.Sc. degree in electrical engineering, physics, material Science, Chemistry or similar discipline (advanced B.Sc. or M.Sc. degree); official enrollment essential
Experience in laboratory work, CAD and know-how in experimental methods using a wide range of advanced materials characterization techniques
Solid programming skills (e.g. LabVIEW, Python etc.)
Experience with finite element modeling advantageous (ANSYS Q3D, COMSOL)
Know-how in data analysis tools and statistics is advantageous
Enthusiastic, self-motivated mindset and ability to work independently
Fluency in written and spoken English (any other language skills are a benefit) and good communication and technical writing skills
